平头哥-AI芯片互联架构师-上海

In this role, you will work with hardware and software engineering groups to define the next-generation inter-chip network architecture for high-performance AI chip and AI network.

• Identifies the challenging problems, and evaluate various architectural solutions for the next-generation of network for AI chip and AI Super Pod.
• Gets strong influences on future AI products by advanced architecture design as the excellent interface between software and hardware.
• Architecture design of AI chip to chip interconnect subsystem, Scale-up Switch chip, C2C link, and etc.
• Documents the high-level architecture specification.
• Participation in defining the micro-architecture of key subsystem.
• Strong technical leadership to achieve successful delivery of final silicon product.
• Works closely with design, software, system, and verification team.

• Minimum Bachelor degree in Computer Science or Electronics Engineering; M.S. or Ph.D. degree is preferred.
• Minimum of 5 years (for M.S.) 3 years (for Ph.D.) of experience on computer architecture or network chip design.
• Smart and show good potential in at least one of the following areas:

1.Server AI chip.
2.Smart NIC/RDMA/RoCE/DPU.
3.State-of-the-art Switch chip.

• Hand-on experience of high-speed interface, such as Die to Die, high speed long-reach SerDes, MAC/PCS, FEC is a plus.
• Hand-on experience of interconnects in AI domain is a big plus.
• Strong knowledge of AI infrastructure and AI network including Scale-up/Scale-out network, and knowledge of LLM inference and training is a big plus.
• Good verbal and written skill for communication.