Manufacturing Engineer Packaging and OSAT

You will translate package requirements into executable assembly flows, specifications, control plans, inspection requirements, and manufacturing documentation. You will lead factory commissioning, qualification, pilot builds, reliability activities, production-readiness reviews, and partner audits. You will improve process capability, yield, quality, and delivery performance while resolving technical issues and implementing controlled changes.

Responsibilities

• Translate package requirements into assembly process flows, manufacturing specifications, control plans, and documentation
• Lead factory commissioning, line bring-up, pilot builds, qualification lots, reliability activities, and production-readiness reviews
• Establish and improve process capability, yield, quality, test, cycle-time, and delivery targets
• Use SPC, DOE, PFMEA, 8D, CAPA, and data-driven problem solving to improve manufacturing results
• Resolve technical issues and implement controlled changes across silicon, package, assembly, test, and factory operations

Requirements

• 5+ years of experience in semiconductor packaging, OSAT manufacturing, assembly engineering, PCBA manufacturing, product engineering, NPI, or a related environment
• Experience with semiconductor assembly, package manufacturing, package test, board assembly, or final product manufacturing
• Experience working with OSATs, substrate suppliers, bumping suppliers, test houses, and contract manufacturers
• Ability to interpret package drawings, BGA maps, BOMs, PCB data, process reports, quality reports, reliability results, and manufacturing documentation