Advanced Packaging Lead Architect

You will lead chip packaging design and simulation from architecture through production. You will coordinate silicon, memory, board, cooling, and supplier stakeholders; own multiphysics analysis and design signoff; and manage packaging design and simulation engineers.

Responsibilities

• Define packaging roadmaps and product architectures
• Lead chip-package-board co-design and design release
• Lead signal integrity, power integrity, thermal, and thermomechanical analysis
• Validate simulations through prototype testing and model correlation
• Manage technical interfaces with foundries, assembly and test partners, and substrate vendors
• Drive pilot builds, qualification, yield improvement, and production ramp
• Establish design review, version control, engineering change, and documentation practices
• Recruit, develop, and manage packaging design and simulation engineers

Requirements

• Bachelor’s degree or above in electrical engineering, microelectronics, materials, mechanical engineering, or a related field
• 10+ years of relevant chip packaging design or development experience
• Experience owning a complex packaging project from architecture through volume production
• Knowledge of flip-chip or FC-BGA, substrate design, materials, and assembly processes
• Hands-on expertise in package design, SI/PI, thermal, or thermomechanical analysis
• Team leadership, cross-functional collaboration, and supplier technical management experience
• Ability to use relevant EDA or simulation tools
• Technical communication and documentation skills in English